Dedicated Etch Equipment Engineer with excellent technical, analytical and communication skills demonstrated by 12 years of experience as a Equipment/Process Engineer and tool owner at Intel FAB 17, 5 years at Global Foundries Fab 8, 3 years at Intel Fab32 and 26 years in the semiconductor industry.
Covered as Module Team Lead (MTL) to ensure engineering team performed duties without excursion and help prevent quality issues.
Led the demolition of TEL RLSA Tool at Fab32 and lead the JHA team for FE TEL in meeting safety goals and ensuring safety of the team
Qualified 2nd Source parts for the Etch area, resulting in savings of greater than $1.2 million annually.
Equipment engineer for Metal Etch tools at Fab 8. Worked on improving tools health and availability from 80% to greater than 90%.
Team lead for Back End of Etch equipment engineering team of 2 college graduates and 1 experienced engineer. Led team to maintain high tools up time and availability to achieve area goal of 85%
Facilitated in the Ramp of Etch Install tools, closing gaps and escalating issues to get better and faster resolution.
Documented Process Transfer from Fab1 Dresden Facility to Fab 8 Malta to facilitate smooth and easy startup to avoid interruptions.
Coordinated New Product Introduction (NPI) activities, resulting in delivering multiple yielding materials to Design team for testing.
Documented effective troubleshooting techniques used by equipment techs for TEL and Hitachi etchers as needed for machine down events
Contributed to an annual 35% increase in productivity through improvements in operations, quality, safety and administration by piloting PM extensions, New Vendor qualifications and improvements in defects.
ISMI
Intel Charity
Global Foundries Etch Soccer Team